In this paper, we attempt to reconstruct one of the last and incomplete projects of Volodya Geyler. We study the motion of a quantum particle in the plane to which a halfline lead is attached, assuming that the particle has spin and the plane component of the Hamiltonian contains a spin-orbit interaction, of Rashba or Dresselhaus type. We construct a class of admissible Hamiltonians and derive an explicit expression for the Green function, which is applied to scattering in a system of this kind.

Let <i>X</i> be a locally compact Hausdorff space and <i>C</i> ₀(<i>X</i>) the Banach space of continuous functions on <i>X</i> vanishing at infinity. In this paper, we shall study unbounded disjointness preserving linear functionals on <i>C</i> ₀(<i>X</i>). They arise from prime ideals of <i>C</i> ₀(<i>X</i>), and we translate it into the cozero set ideal setting. In particular, every unbounded disjointness preserving linear functional of <i>c</i> ₀ can be constructed explicitly through an ultrafilter on complementary to a cozero set ideal. This ultrafilter method can be extended to produce many, but in general not all, such functionals on <i>C</i> ₀(<i>X</i>) for arbitrary <i>X</i>. We also make some remarks where <i>C</i> ₀(<i>X</i>) is replaced by a non-commutative C*-algebra.

In this paper, gold ball wire bonding at low temperature using a high frequency transducer was evaluated. The substrates used were FR-4 laminates with two different gold-plated surface finishes: electrolytic and immersion gold-plated. Bonding temperatures of 120/spl deg/C, 80/spl deg/C and 40/spl deg/C were investigated with 1 mil fine pitch gold wire. Prior to wire bonding, the laminates and dice were plasma treated. The surfaces were analyzed prior to and after plasma treatment before wire bonding using XPS and AFM. Bonded areas were also analyzed using SEM. Design of experiment (DOE) techniques have been employed to optimize the bonding parameters at each temperature. The response of the DOE was evaluated by using bond shear and bond pull. The results show that bonding at low temperature is viable with the use of a high frequency transducer wire bonder.

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